HITAG 1

HITAG 1 A chip module is an electronically packaged chip covered with a globe top cap. The HT1 MOA3 S30 is above all used as card modulei.e. for further lamination into contactless smart cards according to ISO 10536.1. So the HITAG 1 chip module HT1 MOA3 S30 is best suited for customers that do not want to spend time with micro assembly and therefore start - e.g. ISO card production - with the HITAG 1 chip module.

Product Number:
10 units and more: 7.95 US $ 4.95 £ 5,95 € 100 units and more: 3.70 US $ 2.06 £ 2,99 €	warranty: 3 months	Shipping-Info
	higher volumes up on request
Alle Preise sind Netto-Preise. Verkauf nur an gewerbliche Abnehmer. Ask for project-pricing.

The HITAG 1 modules are designed to be connected to a coil and then to be further processed by

packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing

information for the coil-module connection and packaging is given in the specification. Read more...

• Operating Frequency: 100...150kHz

• Total Memory Size (bit): 2048

• Sawn Wafer FFC: YES

• Integrated Resonant Capacitor: YES

• Read/Write Memory: YES

• MOA2 Chip On Board: YES

• Read-only mode (tag talks first): -

• Anticollision Protocol: YES

• Encrypted Mutual Authentication: YES, user configurable

• Irreversible memory lock: YES, user configurable

• Transponder Stick: YES

• ISO 11784/85 Compliance: -

 

Technical Specifications

see Datasheet